Patent Assignment
Reel/Frame 041125/0502
Assignment of Assignor's Interest
Recorded: 2017-01-30
Pages: 12
Assignors
OKA, MIHIR A.
Executed: 2017-01-03
HACKENBERG, KEN P.
Executed: 2017-01-19
SUBRAMANIAN, VIJAY KRISHNAN (VIJAY)
Executed: 2017-01-04
PATEL, NEHA M.
Executed: 2017-01-21
RARAVIKAR, NACHIKET R.
Executed: 2017-01-03
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Sintered Solder for Fine Pitch First-Level Interconnect (Fli) Applications