Patent Assignment
Reel/Frame 041136/0079
Assignment of Assignor's Interest
Recorded: 2017-01-31
Pages: 8
Assignors
HUANG, XINGXING
Executed: 2017-01-13
LIU, KAIKAI
Executed: 2017-01-14
CHEN, SHINENG
Executed: 2017-01-13
Assignee
HUAWEI TECHNOLOGIES CO., LTD.
HUAWEI ADMINISTRATION BUILDING, BANTIAN, LONGGANG DISTRICT, SHENZHEN, GUANGDONG, 518129, CHINA
Covered Property
(1)
Heat Dissipation Assembly and Communications Device