Patent Assignment
Reel/Frame 041138/0297
Assignment of Assignor's Interest
Recorded: 2017-01-31
Pages: 4
Assignor
SCHULTZ, RICHARD T.
Executed: 2017-01-31
Assignee
ADVANCED MICRO DEVICES, INC.
ONE AMD PLACE, P.O. BOX 3453, SUNNYVALE, CALIFORNIA, 94088
Covered Property
(1)
Gate All Around Device Architecture with Hybrid Wafer Bond Technique