Patent Assignment
Reel/Frame 041165/0122
Assignment of Assignor's Interest
Recorded: 2017-02-03
Pages: 4
Assignor
OH, JOO YOUNG
Executed: 2016-12-26
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Stacked Semiconductor Package Having a Support and Method for Fabricating the Same