Patent Assignment
Reel/Frame 041174/0692
Assignment of Assignor's Interest
Recorded: 2017-02-05
Pages: 3
Assignee
SODICK CO., LTD.
3-12-1, NAKAMACHIDAI, TSUZUKI-KU, YOKOHAMA,, KANAGAWA, 224-8522, JAPAN
Covered Property
(1)
Lamination Molding Apparatus