Patent Assignment
Reel/Frame 041184/0064
Assignment of Assignor's Interest
Recorded: 2017-02-06
Pages: 7
Assignors
BALAN, AVIV
Executed: 2017-01-11
CHANDAN, SAVITA
Executed: 2017-01-11
CHEN, CHIA-CHU
Executed: 2016-12-21
HUANG, LUPING
Executed: 2017-01-12
MERIAM, TECK
Executed: 2017-02-06
Assignee
KLA-TENCOR CORPORATION
ONE TECHNOLOGY DRIVE, MILPITAS, CALIFORNIA, 95035
Covered Property
(1)
Methods and Systems for Chucking a Warped Wafer