Patent Assignment
Reel/Frame 041203/0286
Assignment of Assignor's Interest
Recorded: 2017-02-08
Pages: 6
Assignors
TAK, YONG-SUK
Executed: 2016-08-28
LEE, TAE-JONG
Executed: 2016-09-05
PARK, GI-GWAN
Executed: 2016-09-30
LEE, JI-MYOUNG
Executed: 2016-08-28
Assignee
SAMSUNG ELECTRONICS CO., LTD
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Integrated Circuit Device and Method of Fabricating the Same