IP Library › Assignment 041215/0907
Patent Assignment
Reel/Frame 041215/0907

Assignment of Assignor's Interest

Recorded: 2017-02-09 Pages: 6
Assignors
PRABHU, ASHOK S.
Executed: 2017-01-25
KATKAR, RAJESH
Executed: 2016-12-13
MORAN, SEAN
Executed: 2016-12-15
Assignee
INVENSAS CORPORATION
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property (1)
Wafer-Level Flipped Die Stacks with Leadframes or Metal Foil Interconnects
Patent: 9,666,513 →
Application: 15/342,744 →
Publication: US 2017/0077016
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Feb 3, 2017
From: PRABHU, ASHOK S.; KATKAR, RAJESH; MORAN, SEAN
To: INVENSAS CORPORATION
Reel/Frame 041169/0275 →
Security Interest Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Change of Name Nov 24, 2025
From: INVENSAS CORPORATION
To: INVENSAS LLC
Reel/Frame 073508/0758 →
Change of Name Nov 24, 2025
From: INVENSAS LLC
To: ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Reel/Frame 073508/0807 →