Patent Assignment
Reel/Frame 041237/0815
Assignment of Assignor's Interest
Recorded: 2017-02-13
Pages: 11
Assignors
BELANGER, LUC
Executed: 2007-03-27
BUCHWALTER, LEENA PAIVIKKI
Executed: 2007-03-28
BUCHWALTER, STEPHEN L
Executed: 2007-03-28
GIRI, AJAY P
Executed: 2007-03-27
GRIFFITH, JONATHAN H
Executed: 2007-03-27
HENDERSON, DONALD W
Executed: 2007-03-29
KANG, SUNG KWON
Executed: 2007-03-28
LAINE, ERIC HERMAN
Executed: 2007-03-27
LAVOIE, CHRISTIAN
Executed: 2007-03-27
LAURO, PAUL ALFRED
Executed: 2007-03-27
OBERSON, VALERIE ANNE
Executed: 2007-03-27
SHIH, DA-YUAN
Executed: 2007-03-27
SRIVASTAVA, KAMALESH K
Executed: 2007-03-27
SULLIVAN, MICHAEL J
Executed: 2007-03-30
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property
(1)
Interconnection for Flip-Chip Using Lead-Free Solders and Having Improved Reaction Barrier Layers
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.