IP Library › Assignment 041239/0224
Patent Assignment
Reel/Frame 041239/0224

Assignment of Assignor's Interest

Recorded: 2017-02-13 Pages: 3
Assignors
UZOH, CYPRIAN EMEKA
Executed: 2015-08-31
KATKAR, RAJESH
Executed: 2015-08-28
Assignee
INVENSAS CORPORATION
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property (1)
Multiple bond via arrays of different wire heights on a same substrate
Application: 15/430,943 →
Publication: US 2017/0154875
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Feb 13, 2017
From: UZOH, CYPRIAN EMEKA; KATKAR, RAJESH
To: INVENSAS CORPORATION
Reel/Frame 041239/0280 →
Security Interest Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Change of Name Nov 24, 2025
From: INVENSAS LLC
To: ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Reel/Frame 073508/0661 →
Change of Name Nov 24, 2025
From: INVENSAS CORPORATION
To: INVENSAS LLC
Reel/Frame 073689/0793 →