IP Library › Assignment 041243/0153
Patent Assignment
Reel/Frame 041243/0153

Assignment of Assignor's Interest

Recorded: 2017-02-13 Pages: 5
Assignors
HUANG, CHANGJUN
Executed: 2017-02-03
CLARK, JONATHAN
Executed: 2017-02-03
Assignee
SEMTECH CORPORATION
200 FLYNN ROAD, CAMARILLO, CALIFORNIA, 93012
Covered Property (1)
Semiconductor Device and Method of Stacking Semiconductor Die for System-Level Esd Protection
Application: 15/431,528 →
Publication: US 2017/0250172
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Jul 21, 2017
From: SEMTECH CORPORATION; SEMTECH NEW YORK CORPORATION; SIERRA MONOLITHICS, INC.; SEMTECH EV, INC.
To: HSBC BANK USA, NATIONAL ASSOCIATION, AS ADMINISTRATIVE AGENT
Reel/Frame 043070/0051 →
Assignment of Patent Security Interest Previously Recorded at Reel/Frame (043070/0051) Feb 17, 2023
From: HSBC BANK USA, NATIONAL ASSOCIATION, AS RESIGNING AGENT
To: JPMORGAN CHASE BANK, N.A., AS SUCCESSOR AGENT
Reel/Frame 062781/0735 →
Release of Security Interest Jul 8, 2026
From: JPMORGAN CHASE BANK, N.A.
To: SEMTECH CORPORATION; SEMTECH NEW YORK CORPORATION; SIERRA MONOLITHICS, INC.; SEMTECH EV, INC.
Reel/Frame 075211/0699 →