Patent Assignment
Reel/Frame 041251/0579
Assignment of Assignor's Interest
Recorded: 2017-02-14
Pages: 3
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN ROAD 6, HSINCHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Inter-Fan-Out Wafer Level Packaging with Coaxial Tiv for 3D Ic Low-Noise Packaging