Patent Assignment
Reel/Frame 041282/0039
Assignment of Assignor's Interest
Recorded: 2017-02-16
Pages: 4
Assignors
BATINICA, GREGORY
Executed: 2017-01-11
YADAVALLI, KAMESHWAR
Executed: 2017-01-11
FAN, QIAN
Executed: 2017-01-12
HASKELL, BENJAMIN A.
Executed: 2017-01-11
EL-GHOROURY, HUSSEIN S.
Executed: 2017-01-06
Assignee
OSTENDO TECHNOLOGIES, INC.
6185 PASEO DEL NORTE, SUITE 200, CARLSBAD, CALIFORNIA, 92011
Covered Property
(1)
Methods for Improving Wafer Planarity and Bonded Wafer Assemblies Made from the Methods