IP Library › Assignment 041306/0129
Patent Assignment
Reel/Frame 041306/0129

Assignment of Assignor's Interest

Recorded: 2017-01-09 Pages: 5
Assignors
CHAE, EUN HYUK
Executed: 2016-11-29
GU, HYUN HEE
Executed: 2016-11-29
LEE, JONG HO
Executed: 2016-11-29
CHOI, JAE YEOL
Executed: 2016-11-29
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property (1)
Multilayer Ceramic Electronic Component and Board Having the Same
Patent: 9,974,183 →
Application: 15/401,568 →
Publication: US 2017/0367187