Patent Assignment
Reel/Frame 041322/0889
Assignment of Assignor's Interest
Recorded: 2017-02-21
Pages: 3
Assignors
CHANG, KEVIN CHI-WEN
Executed: 2017-02-21
HENSLEY, DAVID
Executed: 2017-02-21
WILKINSON, WILLIAM
Executed: 2017-02-21
Assignee
II-VI OPTOELECTRONIC DEVICES, INC.
141 MOUNT BETHEL ROAD, WARREN, NEW JERSEY, 07059
Covered Property
(1)
Stress Relief in Semiconductor Wafers
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 19, 2019
From: II-VI OPTOELECTRONIC DEVICES, INC.
To: II-VI DELAWARE, INC.
Reel/Frame 048631/0445 →
Notice of Grant of Security Interest in Patents
Sep 25, 2019
From: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 050484/0204 →
Security Interest
Jul 1, 2022
From: II-VI INCORPORATED; II-VI DELAWARE, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 060562/0254 →
Patent Release and Reassignment
Jul 5, 2022
From: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
To: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.
Reel/Frame 060574/0001 →