Patent Assignment
Reel/Frame 041344/0547
Assignment of Assignor's Interest
Recorded: 2017-01-11
Pages: 4
Assignors
HUNG, CHIH-PIN
Executed: 2017-01-10
OU, YING-TE
Executed: 2017-01-10
LEE, PAO-NAN
Executed: 2017-01-10
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property
(1)
Power and Ground Design for Through-Silicon via Structure