Patent Assignment
Reel/Frame 041361/0737
Assignment of Assignor's Interest
Recorded: 2017-02-23
Pages: 3
Assignor
YANG, CHIH-CHAO
Executed: 2017-02-16
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property
(1)
Microstructure Modulation for 3D Bonded Semiconductor Containing an Embedded Resistor Structure