Patent Assignment
Reel/Frame 041382/0304
Assignment of Assignor's Interest
Recorded: 2017-02-27
Pages: 6
Assignors
WANG, WEI-E
Executed: 2017-02-21
RAKSHIT, TITASH
Executed: 2017-02-22
OBRADOVIC, BORNA J.
Executed: 2017-02-22
BOWEN, CHRIS
Executed: 2017-02-22
RODDER, MARK S.
Executed: 2017-02-24
Assignee
SAMSUNG ELECTRONICS CO., LTD
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device Including a Repeater/Buffer at Upper Metal Routing Layers and Methods of Manufacturing the Same