Patent Assignment
Reel/Frame 041405/0808
Assignment of Assignor's Interest
Recorded: 2017-02-28
Pages: 14
Assignors
CHEN, SHIN-CHI
Executed: 2017-02-21
CHEN, CHIH-CHUNG
Executed: 2017-02-21
LIU, AN-CHI
Executed: 2017-02-21
LI, CHIH-YUEH
Executed: 2017-02-21
YEH, PEI-CHING
Executed: 2017-02-21
YANG, TSUNG-CHIEH
Executed: 2017-02-21
Assignee
UNITED MICROELECTRONICS CORP.
NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU CITY, TAIWAN
Covered Property
(1)
Insulating Layer Next to Fin Structure and Method of Removing Fin Structure