Patent Assignment
Reel/Frame 041422/0366
Assignment of Assignor's Interest
Recorded: 2017-03-01
Pages: 7
Assignors
CHUNG, JAE-YUP
Executed: 2016-11-21
UM, MYUNG-YOON
Executed: 2016-11-22
CHA, DONG-HO
Executed: 2016-11-21
YOU, JUNG-GUN
Executed: 2017-01-19
PARK, GI-GWAN
Executed: 2016-11-23
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Integrated Circuit Device and Method of Manufacturing the Same