Patent Assignment
Reel/Frame 041447/0318
Assignment of Assignor's Interest
Recorded: 2017-03-02
Pages: 4
Assignee
SHOWA DENKO K.K.
13-9, SHIBADAIMON 1-CHOME, MINATO-KU, TOKYO, 105-8518, JAPAN
Covered Property
(1)
Surface Machining Method for Single Crystal Sic Substrate, Manufacturing Method Thereof, and Grinding Plate for Surface Machining Single Crystal Sic Substrate
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.