IP Library › Assignment 041463/0197
Patent Assignment
Reel/Frame 041463/0197

Assignment of Assignor's Interest

Recorded: 2017-03-03 Pages: 4
Assignor
KULICK, JASON M.
Executed: 2014-11-05
Assignee
INDIANA INTEGRATED CIRCUITS, LLC
1400 E. ANGELA BLVD., UNIT 107, SOUTH BEND, INDIANA, 46617
Covered Property (1)
Quilt Packaging System with Mated Metal Interconnect Nodules and Voids
Application: 15/448,026 →
Publication: US 2017/0179093
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 3, 2017
From: HALL, DOUGLAS
To: UNIVERSITY OF NOTRE DAME DU LAC
Reel/Frame 041463/0274 →
Assignment of Assignor's Interest Mar 3, 2017
From: BERNSTEIN, GARY
To: UNIVERSITY OF NOTRE DAME DU LAC
Reel/Frame 041463/0391 →
Assignment of Assignor's Interest Mar 3, 2017
From: HOFFMAN, ANTHONY
To: UNIVERSITY OF NOTRE DAME DU LAC
Reel/Frame 041463/0578 →
Assignment of Assignor's Interest Mar 3, 2017
From: HOWARD, SCOTT
To: UNIVERSITY OF NOTRE DAME DU LAC
Reel/Frame 041463/0685 →