Patent Assignment
Reel/Frame 041485/0264
Assignment of Assignor's Interest
Recorded: 2017-03-07
Pages: 4
Assignors
LEE, DOO HWAN
Executed: 2017-02-24
KIM, JU HYEON
Executed: 2017-02-24
AHN, DAE KYU
Executed: 2017-02-22
JEONG, SUNG WON
Executed: 2017-02-22
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Fan-Out Semiconductor Package
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.