Patent Assignment
Reel/Frame 041500/0675
Assignment of Assignor's Interest
Recorded: 2017-03-08
Pages: 3
Assignor
GRIVNA, GORDON M.
Executed: 2017-03-08
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD, MAILDROP A700, PHOENIX, ARIZONA, 85008
Covered Property
(1)
Semiconductor Device and Method of Forming Backside Openings for an Ultra-Thin Semiconductor Die
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Patent Security Agreement
Nov 17, 2017
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 044481/0541 →
Release of Security Interest in Patents Recorded at Reel 04481, Frame 0541
Jun 22, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064072/0459 →