Patent Assignment
Reel/Frame 041523/0750
Assignment of Assignor's Interest
Recorded: 2017-03-09
Pages: 6
Assignors
YANG, CHE-WEI
Executed: 2017-02-08
LIN, HAO-HSIUNG
Executed: 2017-02-08
PAN, SAMUEL C
Executed: 2017-02-20
Assignees
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, 300, TAIWAN
NATIONAL TAIWAN UNIVERSITY
NO. 1, SEC. 4, ROOSEVELT RD., TAIPEI, TAIWAN
Covered Property
(1)
Method for Forming Stressor, Semiconductor Device Having Stressor, and Method for Forming the Same