IP Library Assignment 041572/0995
Patent Assignment
Reel/Frame 041572/0995

Assignment of Assignor's Interest

Recorded: 2017-01-31 Pages: 5
Assignors
OH, KYUNG SEOB
Executed: 2017-01-17
HARR, KYOUNG MOO
Executed: 2017-01-17
LEE, DOO HWAN
Executed: 2017-01-18
OH, SEUNG CHUL
Executed: 2017-01-18
KIM, HYOUNG JOON
Executed: 2017-01-18
CHO, YOON SUK
Executed: 2017-01-18
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property (1)
Fan-Out Semiconductor Package
Patent: 9,881,873 →
Application: 15/420,558 →
Publication: US 2017/0365558
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 3, 2019
From: SAMSUNG ELECTRO-MECHANICS CO., LTD.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 049350/0756 →