Patent Assignment
Reel/Frame 041583/0063
Assignment of Assignor's Interest
Recorded: 2017-03-15
Pages: 6
Assignors
KWON, HEUNGKYU
Executed: 2017-03-14
KIM, JAE CHOON
Executed: 2017-03-14
CHO, EUNSEOK
Executed: 2017-03-14
KIM, JICHUL
Executed: 2017-03-14
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Surface Temperature Management Method of Mobile Device and Memory Thermal Management Method of Multichip Package