Patent Assignment
Reel/Frame 041586/0469
Assignment of Assignor's Interest
Recorded: 2017-03-15
Pages: 7
Assignors
KIM, OHHAN
Executed: 2017-03-15
KIM, KYUNGHWAN
Executed: 2017-03-15
BEAK, WOONJAE
Executed: 2017-03-15
LEE, HUNTEAK
Executed: 2017-03-15
YOON, INSANG
Executed: 2017-03-15
Assignee
STATS CHIPPAC PTE. LTD.
10 ANG MO KIO STREET 65, TECHPOINT #04-08/09, SINGAPORE, 569059, SINGAPORE
Covered Property
(1)
Method of Forming SIP Module Over Film Layer
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.