IP Library Assignment 041591/0060
Patent Assignment
Reel/Frame 041591/0060

Assignment of Assignor's Interest

Recorded: 2017-03-16 Pages: 4
Assignors
LAI, MIN-TIH TED
Executed: 2017-01-31
LEUTEN, TYLER
Executed: 2017-01-31
PON, FLORENCE R.
Executed: 2017-01-31
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95054
Covered Property (1)
Post-Grind Die Backside Power Delivery
Application: 15/391,587 →
Publication: US 2018/0182699
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 17, 2025
From: INTEL CORPORATION
To: SK HYNIX NAND PRODUCT SOLUTIONS CORP. (DBA SOLIDIGM)
Reel/Frame 072792/0414 →