Patent Assignment
Reel/Frame 072792/0414
Assignment of Assignor's Interest
Recorded: 2025-09-17
Pages: 70
Assignor
INTEL CORPORATION
Executed: 2025-08-19
Assignee
SK HYNIX NAND PRODUCT SOLUTIONS CORP. (DBA SOLIDIGM)
10951 WHITE ROCK ROAD, RANCHO CORDOVA, CALIFORNIA, 95670
Covered Properties
(25)
Secure Memory
Post-Grind Die Backside Power Delivery
Method and Apparatus for Range Based Checkpoints in a Storage Device
Selective Performance Level Modes of Operation in a Non-Volatile Memory
Storage System, Computer Program Product, and Method for Managing a Hybrid Memory Device System
Methods and Apparatus to Perform Atomic Transactions in Nonvolatile Memory Under Hardware Transactional Memory
Techniques for Correcting Data Errors in Memory Devices
Packaged Die Stacks with Stacked Capacitors and Methods of Assembling Same
Post-Grind Die Backside Power Delivery
Through Mold via (Tmv) Using Stacked Modular Mold Rings
Semiconductor Package Having Singular Wire Bond on Bonding Pads
Electronic Device Package
Decoupling Capacitor Mounted on an Integrated Circuit Die, and Method of Manufacturing the Same
Embedded Component and Methods of Making the Same
Solid State Memory Case with Enhanced Cooling
Die Stack with Reduced Warpage
Secure Memory
Methods and Apparatus to Perform Error Detection and/or Correction in a Memory Device
Integrated Circuit Components with Dummy Structures
Reducing Band-to-Band Tunneling in Semiconductor Devices
Post-Grind Die Backside Power Delivery
Packaged Die Stacks with Stacked Capacitors and Methods of Assembling Same
Secure Memory
Die Stack with Reduced Warpage
Embedded Component and Methods of Making the Same
Related Assignments
(14)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 18, 2017
From: PEARSON, ADRIAN; SAHITA, RAVI L.; BOYER, BENJAMIN W.; TRIKA, SANJEEV
To: INTEL CORPORATION
Reel/Frame 041004/0174 →
Assignment of Assignor's Interest
Mar 16, 2017
From: LAI, MIN-TIH TED; LEUTEN, TYLER; PON, FLORENCE R.
To: INTEL CORPORATION
Reel/Frame 041591/0060 →
Assignment of Assignor's Interest
Apr 20, 2017
From: LI, PENG; TRIKA, SANJEEV N.
To: INTEL CORPORATION
Reel/Frame 042302/0076 →
Assignment of Assignor's Interest
Jul 24, 2017
From: BRANCO, RODRIGO R.; GUERON, SHAY
To: INTEL CORPORATION
Reel/Frame 043077/0339 →
Assignment of Assignor's Interest
Jul 31, 2017
From: DOSHI, KSHITIJ A.; SUKHOMLINOV, VADIM; DEMENTIEV, ROMAN
To: INTEL CORPORATION
Reel/Frame 043141/0226 →
Assignment of Assignor's Interest
Dec 5, 2017
From: CONNOR, CHRISTOPHER F.; QUERBACH, BRUCE; BELGAL, HANMANT P.
To: INTEL CORPORATION
Reel/Frame 044299/0290 →
Assignment of Assignor's Interest
Feb 28, 2018
From: MOTWANI, RAVI H.; VANAPARTHY, SANTOSH K.
To: INTEL CORPORATION
Reel/Frame 045062/0318 →
Assignment of Assignor's Interest
May 1, 2019
From: CHEAH, BOK ENG; CHANG, MOOI LING; OOI, PING PING; KONG, JACKSON CHUNG PENG
To: INTEL CORPORATION
Reel/Frame 049049/0576 →
Assignment of Assignor's Interest
Sep 9, 2019
From: TAN, AIPING; DING, ZHICHENG; LIU, BIN; SHE, YONG
To: INTEL CORPORATION
Reel/Frame 050313/0446 →
Assignment of Assignor's Interest
Mar 4, 2020
From: MOTWANI, RAVI H.; VANAPARTHY, SANTHOSH K.
To: INTEL CORPORATION
Reel/Frame 052010/0347 →
Assignment of Assignor's Interest
Nov 11, 2020
From: LONG, BRIAN J.
To: INTEL CORPORATION
Reel/Frame 054334/0372 →
Assignment of Assignor's Interest
Apr 21, 2021
From: XU, YI
To: INTEL CORPORATION
Reel/Frame 055995/0387 →
Assignment of Assignor's Interest
Dec 20, 2022
From: PON, FLORENCE R.; LEUTEN, TYLER; YAP, JOHN K.
To: INTEL CORPORATION
Reel/Frame 062163/0767 →
Assignment of Assignor's Interest
Aug 11, 2023
From: DING, ZHICHENG; LIU, BIN; SHE, YONG; KIM, HYOUNG IL
To: INTEL CORPORATION
Reel/Frame 064559/0966 →