Electronic device package
Electronic device package technology is disclosed. An electronic device package in accordance with the present disclosure can include an electronic component, a redistribution layer, and an interposer electrically coupling the redistribution layer and the electronic component. The interposer can have interconnect interfaces on a top side electrically coupled to the electronic component and interconnect interfaces on a bottom side electrically coupled to the redistribution layer. A density of the interconnect interfaces on the top side can be greater than a density of the interconnect interfaces on the bottom side. Associated systems and methods are also disclosed.
1. An electronic device package, comprising:
an electronic component;
a redistribution layer;
an interposer on the redistribution layer and laterally spaced apart from the electronic component, the interposer electrically coupling the redistribution layer and the electronic component, the interposer having interconnect interfaces on a top side electrically coupled to the electronic component and interconnect interfaces on a bottom side electrically coupled to the redistribution layer, and the interposer having a first outermost sidewall and a second outermost sidewall between the top side and the bottom side, the second outermost sidewall laterally opposite the first outermost sidewall, wherein a density of the interconnect interfaces on the top side is greater than a density of the interconnect interfaces on the bottom side, and wherein the redistribution layer extends laterally beyond the first outermost sidewall and the second outermost sidewall of the interposer; and
a mold compound encapsulating the electronic component and the interposer, the mold compound on the redistribution layer.
2. The electronic device package of claim 1 , wherein the interconnect interfaces on the top side of the interposer comprise wire bond landings.
3. The electronic device package of claim 2 , wherein the interposer and the electronic component are electrically coupled by a wire bond connection.
4. The electronic device package of claim 1 , wherein the interconnect interfaces on the bottom side of the interposer comprise pads.
5. The electronic device package of claim 1 , wherein the mold compound comprises an epoxy.
6. The electronic device package of claim 1 , wherein the redistribution layer comprises a single layer.
7. The electronic device package of claim 1 , wherein the electronic component comprises a plurality of electronic components in a stacked arrangement.
8. The electronic device package of claim 7 , wherein at least some of the plurality of electronic components are electrically coupled to one another by wire bond connections.
9. The electronic device package of claim 1 , further comprising a second electronic component, and a second interposer electrically coupling the redistribution layer and the second electronic component.
10. The electronic device package of claim 9 , wherein the second electronic component comprises a plurality of second electronic components in a stacked arrangement.
11. The electronic device package of claim 10 , wherein at least some of the plurality of second electronic components are electrically coupled to one another by wire bond connections.
12. The electronic device package of claim 1 , further comprising interconnect structures coupled to a bottom side of the redistribution layer to facilitate electrically coupling the electronic device package with an external electronic component.
13. The electronic device package of claim 12 , wherein the interconnect structures comprise solder balls.
14. The electronic device package of claim 1 , wherein the electronic component comprises an integrated circuit.
15. The electronic device package of claim 14 , wherein the integrated circuit comprises an application specific integrated circuit, computer memory, or a combination thereof.