Integrated circuit components with dummy structures
Disclosed herein are integrated circuit (IC) components with dummy structures, as well as related methods and devices. For example, in some embodiments, an IC component may include a dummy structure in a metallization stack. The dummy structure may include a dummy material having a higher Young's modulus than an interlayer dielectric of the metallization stack.
1. An integrated circuit (IC) component, comprising:
a metallization stack including an interlayer dielectric and a conductive line or via; and
a dummy structure in the metallization stack, wherein the dummy structure includes a dummy material, wherein the dummy material has a higher Young's modulus than the interlayer dielectric and the dummy material has a higher Young's modulus than the conductive line or via.
2. The IC component of claim 1 , wherein the dummy material includes silicon carbide, silicon nitride, or aluminum oxide.
3. The IC component of claim 1 , wherein the metallization stack includes an inductor.
4. The IC component of claim 1 , wherein the metallization stack includes a conductive line, and the dummy structure has a width that is greater than 1.5 times a width of the conductive line.
5. The IC component of claim 1 , wherein the dummy material includes a ferromagnetic material.
6. The IC component of claim 5 , wherein the metallization stack includes a copper line or a copper via.
7. The IC component of claim 1 , wherein the dummy structure is at least partially in a top interconnect layer in the metallization stack.
8. The IC component of claim 1 , wherein the IC component is a die.
9. An integrated circuit (IC) component, comprising:
an inductor in a metallization stack; and
a dummy structure in an interior of the inductor, wherein the dummy structure includes a dummy material; wherein the dummy material has a higher Young's modulus than an interlayer dielectric of the metallization stack.
10. The IC component of claim 9 , wherein the dummy structure is part of an array including a plurality of dummy structures in the metallization stack, and the array is in the interior of the inductor.
11. The IC component of claim 10 , wherein the array is spaced a first distance from a first segment of the inductor, the array is spaced a second distance from a second segment of the inductor, and the first distance and the second distance are equal.
12. The IC component of claim 9 , wherein the inductor has a thickness including multiple conductive lines and at least one conductive via.
13. A computing device, comprising:
a circuit board; and
an integrated circuit (IC) component, coupled to the circuit board, wherein the IC component includes:
a metallization stack including an interlayer dielectric and a conductive line or via, and
a dummy structure in the metallization stack, wherein the dummy structure includes a dummy material, wherein the dummy material has a higher Young's modulus than the interlayer dielectric and the dummy material has a higher Young's modulus than the conductive line or via.
14. The computing device of claim 13 , wherein the IC component is a die, a package substrate, or an interposer.
15. The computing device of claim 13 , wherein the IC component includes radio frequency (RF) circuitry.
16. The computing device of claim 13 , wherein the IC component includes power circuitry.
17. The computing device of claim 13 , wherein the computing device is a server, hand-held computing device, or wearable computing device.