IP Library Assignment 050313/0446
Patent Assignment
Reel/Frame 050313/0446

Assignment of Assignor's Interest

Recorded: 2019-09-09 Pages: 3
Assignors
TAN, AIPING
Executed: 2017-03-24
DING, ZHICHENG
Executed: 2017-03-24
LIU, BIN
Executed: 2017-03-24
SHE, YONG
Executed: 2017-03-24
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95054
Covered Property (1)
Die Stack with Reduced Warpage
Application: 16/492,323 →
Publication: US 2020/0051929
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 17, 2025
From: INTEL CORPORATION
To: SK HYNIX NAND PRODUCT SOLUTIONS CORP. (DBA SOLIDIGM)
Reel/Frame 072792/0414 →