IP Library Assignment 055995/0387
Patent Assignment
Reel/Frame 055995/0387

Assignment of Assignor's Interest

Recorded: 2021-04-21 Pages: 3
Assignor
XU, YI
Executed: 2016-12-28
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property (1)
Semiconductor Package Having Singular Wire Bond on Bonding Pads
Application: 16/349,096 →
Publication: US 2019/0273067
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 17, 2025
From: INTEL CORPORATION
To: SK HYNIX NAND PRODUCT SOLUTIONS CORP. (DBA SOLIDIGM)
Reel/Frame 072792/0414 →