Post-grind die backside power delivery
Disclosed is a die. The die may include a material layer, a plurality of vias, and a plurality of metal channels. The material layer may have a top side and a backside. The top side may include a plurality of pad connections. The plurality of vias may extend through the material layer from the top side to the backside. The plurality of metal channels may be in contact with the backside. Each of the plurality of metal channels may be in electrical communication with at least one of the plurality of pad connections and at least one of the plurality of vias.
1. A microelectronics package comprising:
a package substrate; and
a die connected to the package substrate, the die comprising:
a material layer having a top side and a backside, the top side including a plurality of pad connections, the backside including a power connection;
a plurality of vias extending through the material layer from the top side to the backside; and
a plurality of metal channels in contact with the backside, each of the plurality of metal channels in electrical communication with at least one of the plurality of pad connections and at least one of the plurality of vias, at least one of the plurality of metal channels in electrical communication with the power connection,
wherein a first metal channel of the plurality of metal channels is located adjacent a reference channel within the material layer.
2. The microelectronics package of claim 1 , wherein the material layer comprises a semiconductor material.
3. The microelectronics package of claim 1 , wherein the die is one of a plurality of dies located on a semiconductor wafer.
4. The microelectronics package of claim 1 , wherein the top side comprises integrated circuitry in electrical communication with the plurality of pad connections.
5. The microelectronics package of claim 1 , wherein at least one of the plurality of metal channels is a reference plane.
6. The microelectronics package of claim 1 , wherein each of the plurality of metal channels are substantially wider than a width of each of a plurality of signal traces located on the top side of the material layer.
7. The microelectronics package of claim 1 , wherein each of the plurality of metal channels has a width at least one order of magnitude greater than a width of each of a plurality of signal traces located on the top side of the material layer.
8. The microelectronics package of claim 1 , wherein the die is a component of a memory board, a motherboard, a sound card, or a video card.
9. The microelectronics package of claim 1 , wherein the plurality of metal channels are manufactured from a metal selected from the group consisting of copper, gold, platinum, or aluminum.
10. The microelectronics package of claim 1 , further comprising:
a second material layer having a second top side and a second backside, the second top side including a second plurality of pad connections connected to the plurality of pad connections;
a second plurality of vias extending through the second material layer from the second top side to the second backside; and
a second plurality of metal channels in contact with the second backside, each of the second plurality of metal channels in electrical communication with at least one of the second plurality of pad connections and at least one of the second plurality of vias.
11. The microelectronics package of claim 1 , wherein the top side comprises integrated circuitry in electrical communication with the plurality of pad connections.
12. A microelectronics package comprising:
a package substrate; and
a die connected to the package substrate, the die comprising:
a material layer having a top side and a backside, the top side including a plurality of pad connections, the backside including a power connection;
a plurality of vias extending through the material layer from the top side to the backside;
a first metal layer in contact with the backside, the first metal layer in electrical communication with at least one of the plurality of pad connections and a first subset of the plurality of vias; and
a second metal layer located adjacent to the first metal layer and separated by a dielectric, the second metal layer in electrical communication with a second subset of the plurality of vias, the second metal layer being a reference plane,
wherein the first metal layer is in electrical communication with the power connection.
13. The microelectronics package of claim 12 , wherein the material layer comprises a semiconductor based material.
14. The microelectronics package of claim 12 , wherein the die is one of a plurality of dies located on a semiconductor wafer.
15. The microelectronics package of claim 12 , wherein the top side comprises integrated circuitry in electrical communication with the plurality of pad connections.
16. The microelectronics package of claim 12 , wherein the microelectronics package is a component of a memory board, a motherboard, a sound card, or a video card.
17. The microelectronics package of claim 12 , wherein the first metal layer and the second metal layer are manufactured from a metal selected from the group consisting of copper, gold, platinum, or aluminum.
18. The microelectronics package of claim 12 , further comprising:
a second material layer having a second top side and a second backside, the second top side including a second plurality of pad connections connected to the plurality of pad connections;
a second plurality of vias extending through the second material layer from the second top side to the second backside;
a third metal layer in contact with the second backside, the third metal layer in electrical communication with at least one of the second plurality of pad connections and a first subset of the second plurality of vias; and
a fourth metal layer located adjacent to the third metal layer and separated by a second dielectric, the fourth metal layer in electrical communication with a second subset of the second plurality of vias.
19. A memory board, a motherboard, a sound card, or a video card comprising:
a package substrate; and
a die connected to the package substrate, the die comprising:
a material layer having a top side and a backside, the top side including a plurality of pad connections and integrated circuitry in electrical communication with the plurality of pad connections, the backside including a power connection;
a plurality of vias extending through the material layer from the top side to the backside;
a first metal layer in contact with the backside, the first metal layer in electrical communication with at least one of the plurality of pad connections and a first subset of the plurality of vias; and
a second metal layer located adjacent to the first metal layer and separated by a dielectric, the second metal layer in electrical communication with a second subset of the plurality of vias, the second metal layer being a reference plane,
wherein the first metal layer is in electrical communication with the power connection.
20. The memory board, a motherboard, a sound card, or a video card of claim 19 , further comprising:
a second material layer having a second top side and a second backside, the second top side including a second plurality of pad connections connected to the plurality of pad connections;
a second plurality of vias extending through the second material layer from the second top side to the second backside;
a third metal layer in contact with the second backside, the third metal layer in electrical communication with at least one of the second plurality of pad connections and a first subset of the second plurality of vias; and
a fourth metal layer located adjacent to the third metal layer and separated by a second dielectric, the fourth metal layer in electrical communication with a second subset of the second plurality of vias.