Patent Assignment
Reel/Frame 049049/0576
Assignment of Assignor's Interest
Recorded: 2019-05-01
Pages: 5
Assignors
CHEAH, BOK ENG
Executed: 2018-08-09
CHANG, MOOI LING
Executed: 2018-08-09
OOI, PING PING
Executed: 2018-08-09
KONG, JACKSON CHUNG PENG
Executed: 2018-08-10
LUM, WEN WEI
Executed: 2018-08-09
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Packaged Die Stacks with Stacked Capacitors and Methods of Assembling Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.