IP Library Assignment 041599/0683
Patent Assignment
Reel/Frame 041599/0683

Assignment of Assignor's Interest

Recorded: 2017-03-16 Pages: 3
Assignors
RENARD, LOIC PIERRE LOUIS
Executed: 2016-10-04
ANG, CHENG-LAY
Executed: 2016-10-04
Assignee
STMICROELECTRONICS PTE LTD
28 ANG MO KIO INDUSTRIAL PARK 2, SINGAPORE, 569508, SINGAPORE
Covered Property (1)
Optical Sensor Package Including a Cavity Formed in an Image Sensor Die
Patent: 9,911,890 →
Application: 15/199,390 →
Publication: US 2018/0006182
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 18, 2024
From: STMICROELECTRONICS PTE LTD
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 068433/0970 →