Patent Assignment
Reel/Frame 041600/0906
Assignment of Assignor's Interest
Recorded: 2017-03-16
Pages: 11
Assignors
NODA, TAKAAKI
Executed: 2017-02-02
NOHARA, SHINGO
Executed: 2017-02-02
TAKAGI, KOSUKE
Executed: 2017-02-07
HANASHIMA, TAKEO
Executed: 2017-02-02
SUEYOSHI, MAMORU
Executed: 2017-02-02
KONNO, KOTARO
Executed: 2017-02-06
SAWADA, MOTOSHI
Executed: 2017-02-02
Assignee
HITACHI KOKUSAI ELECTRIC INC.
15-12, NISHI-SHIMBASHI 2-CHOME, MINATO-KU, TOKYO, 105-8039, JAPAN
Covered Property
(1)
Method of Manufacturing Semiconductor Device by Forming a Film on a Substrate, Substrate Processing Apparatus, and Recording Medium
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.