Patent Assignment
Reel/Frame 041605/0963
Assignment of Assignor's Interest
Recorded: 2017-02-02
Pages: 7
Assignors
VILLAMOR, AIRA LOURDES
Executed: 2017-01-31
CRUZ, ERWIN VICTOR
Executed: 2017-02-01
SUICO, GERALDINE
Executed: 2017-01-31
SABANDO, SILNORE
Executed: 2017-01-31
Assignee
FAIRCHILD SEMICONDUCTOR CORPORATION
1272 BORREGAS AVENUE, SUNNYVALE, CALIFORNIA, 94089
Covered Property
(1)
Packaged Semiconductor Devices with Laser Grooved Wettable Flank and Methods of Manufacture
Patent:
9,978,668 →
Application:
15/407,918 →
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Patent Security Agreement
Nov 17, 2017
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 044481/0541 →
Assignment of Assignor's Interest
Aug 3, 2021
From: FAIRCHILD SEMICONDUCTOR CORPORATION
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 057694/0374 →
Release of Security Interest
Oct 28, 2021
From: DEUTSCHE BANK AG NEW YORK BRANCH
To: FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 057969/0206 →
Security Interest
Nov 12, 2021
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 058871/0799 →
Release of Security Interest in Patents Recorded at Reel 04481, Frame 0541
Jun 22, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064072/0459 →
Release of Security Interest in Patents Recorded at Reel 058871, Frame 0799
Jun 23, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 065653/0001 →