IP Library Assignment 041608/0945
Patent Assignment
Reel/Frame 041608/0945

Assignment of Assignor's Interest

Recorded: 2017-03-17 Pages: 4
Assignors
AOKI, YU
Executed: 2015-05-12
NOBE, SHIGERU
Executed: 2015-05-15
MATSUTANI, HIROSHI
Executed: 2015-05-21
KASUYA, KEI
Executed: 2015-05-19
TANIMOTO, AKITOSHI
Executed: 2015-05-12
TAHARA, SHINGO
Executed: 2015-05-13
Assignee
HITACHI CHEMICAL COMPANY, LTD.
9-2 MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property (1)
Photosensitive Resin Composition, Method for Producing Patterned Cured Film, Semiconductor Element and Electronic Device
Patent: 9,633,848 →
Application: 14/438,744 →
Publication: US 2015/0325431
Related Assignments (5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 6, 2015
From: AOKI, YU; NOBE, SHIGERU; MATSUTANI, HIROSHI; KASUYA, KEI
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 036270/0895 →
Corrective Assignment to Correct the Serial Number 14438777 T0 14438744 Previously Recorded on Reel 036270 Frame 0895. Assignor(S) Hereby Confirms the Assignment. Jun 25, 2018
From: AOKI, YU; NOBE, SHIGERU; MATSUTANI, HIROSHI; KASUYA, KEI
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 046425/0645 →
Change of Name Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →