Patent Assignment
Reel/Frame 041614/0125
Assignment of Assignor's Interest
Recorded: 2017-03-17
Pages: 4
Assignor
LAI, CHAO-MIN
Executed: 2017-03-14
Assignee
REALTEK SEMICONDUCTOR CORP.
NO.2, INNOVATION ROAD II, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Electronic Apparatus and Heat Dissipation and Emi Shielding Structure Thereof