Patent Assignment
Reel/Frame 041615/0869
Assignment of Assignor's Interest
Recorded: 2017-03-17
Pages: 3
Assignors
CHUANG, HARRY-HAK-LAY
Executed: 2017-03-07
WANG, HUNG-CHO
Executed: 2017-03-07
YOU, WEN-CHUN
Executed: 2017-03-07
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN ROAD 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Structure and Formation Method of Integrated Circuit Structure