Patent Assignment
Reel/Frame 041623/0523
Assignment of Assignor's Interest
Recorded: 2017-03-17
Pages: 7
Assignors
HADA, KEIKO
Executed: 2017-01-05
SHIMIZU, AKITAKA
Executed: 2017-01-05
NAGAKURA, KOICHI
Executed: 2017-01-16
TACHIBANA, MITSUHIRO
Executed: 2017-01-05
Assignee
TOKYO ELECTRON LIMITED
AKASAKA BIZ TOWER, 3-1 AKASAKA 5-CHOME, MINATO-KU, TOKYO, 107-6325, JAPAN
Covered Property
(1)
Substrate Processing Method, Substrate Processing Apparatus and Substrate Processing System