Patent Assignment
Reel/Frame 041639/0273
Assignment of Assignor's Interest
Recorded: 2017-03-20
Pages: 6
Assignors
KIM, YOUNG LYONG
Executed: 2016-12-06
PARK, JIN-WOO
Executed: 2016-12-06
YIM, CHOONGBIN
Executed: 2016-12-06
MIN, YOUNJI
Executed: 2016-12-06
Assignee
SAMSUNG ELECTRONICS CO., LTD
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Packages and Methods of Manufacturing the Same