Patent Assignment
Reel/Frame 041639/0688
Assignment of Assignor's Interest
Recorded: 2017-03-20
Pages: 3
Assignors
WU, KUO-MING
Executed: 2017-03-10
LIU, KUAN-LIANG
Executed: 2017-03-10
CHEN, PAO-TUNG
Executed: 2017-03-10
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Metal Line Design for Hybrid-Bonding Application