Patent Assignment
Reel/Frame 041640/0203
Assignment of Assignor's Interest
Recorded: 2017-03-20
Pages: 6
Assignors
KIM, JAE-CHEOL
Executed: 2017-02-27
KANG, GIL-MAN
Executed: 2017-02-27
CHO, KYOUNG-BOK
Executed: 2017-02-27
HA, YONG-DAE
Executed: 2017-03-01
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Apparatus for Correcting a Parallelism Between a Bonding Head and a Stage, and a Chip Bonder Including the Same