Apparatus for correcting a parallelism between a bonding head and a stage, and a chip bonder including the same

1. A bonding apparatus, comprising:

a bonding head including a bonding shaft;

a collet attached to the bonding head;

a stage, wherein a package substrate is disposed on the stage;

a detector circuit that determines whether the collet and the stage are parallel to each other during a bonding process, wherein the bonding head is configured to bond a semiconductor chip to the package substrate; and

a correcting unit including a first correcting block and a second correcting block disposed on the first correcting block, wherein the first correcting block is attached to the bonding shaft and includes a first curved surface, wherein the second correcting block includes a second curved surface, wherein the collet is disposed on the second correcting block, wherein the correcting unit adjusts at least one of the collet or the stage based on the determination of the detector circuit during the bonding process, wherein, when it is determined that the collet and stage are not parallel to each other, the second correcting block is configured to detach, with the collet, from the first correcting block to be disposed on the stage and away from the package substrate, and then, to reattach, with the collet, to the first correcting block so as to be removed from the stage.

2. The apparatus of claim 1 , wherein the detector circuit comprises a sensor attached to the bonding head and that detects a lateral load applied to the bonding head.

3. The apparatus of claim 1 , wherein the detector circuit comprises a displacement sensor attached to the bonding head and that detects a lateral displacement of the bonding head.

4. The apparatus of claim 1 , wherein the detector circuit comprises a strain sensor attached to the bonding head and that detects a lateral strain of the bonding head.

5. The apparatus of claim 1 , wherein the detector circuit comprises an encoder attached to the bonding head to detect an inclination angle of the bonding head.

6. The apparatus of claim 1 , Wherein the detector circuit comprises a load cell disposed under the bonding head and that detects a pressure of the bonding head.

7. The apparatus of claim 1 , wherein

the second correcting block is installed at the collet,

wherein the collet is configured to hold the semiconductor chip and to be connected to the first correcting block, and

wherein the second surface of the correcting block is configured to engage with the first curved surface of the first correcting block.

8. The apparatus of claim 7 , wherein the first curved surface is concave and is disposed at a lower surface of the first correcting block, the second curved surface is convex and is disposed at an upper surface of the second correcting block, and the second curved surface has a curvature substantially the same as a curvature of the first curved surface.

9. The apparatus of claim 7 , wherein the correcting unit further comprises a lifter that moves the second curved surface upward toward the first curved surface such that the second curved surface contacts the first curved surface.

10. The apparatus of claim 7 , wherein the correcting unit further comprises a vacuum-applying member that provides a vacuum force between the first curved surface and the second curved surface.

11. The apparatus of claim 7 , wherein the correcting unit further comprises at least one camera that photographs at least one of the bonding head or the stage.

12. The apparatus of claim 7 , further comprising a checking unit that checks whether the bonding head and the stage are sufficiently parallel to each other after the correcting unit is used to adjust at least one of the bonding head or the stage.

13. The apparatus of claim 12 , wherein the checking unit further comprises a load sensor disposed on the stage, wherein the load sensor measures loads applied from at least two different areas of a lower surface of the bonding head.