Patent Assignment
Reel/Frame 041647/0272
Assignment of Assignor's Interest
Recorded: 2017-03-20
Pages: 2
Assignors
MIYAMOTO, HIRONOBU
Executed: 2017-01-31
OKAMOTO, YASUHIRO
Executed: 2017-01-31
KAWAGUCHI, HIROSHI
Executed: 2017-01-31
NAKAYAMA, TATSUO
Executed: 2017-01-31
Assignee
RENESAS ELECTRONICS CORPORATION
2-24, TOYOSU 3-CHOME, KOUTOU-KU, TOKYO, 135-0061, JAPAN
Covered Property
(1)
Semiconductor Device and Method for Manufacturing the Same