Patent Assignment
Reel/Frame 041689/0606
Assignment of Assignor's Interest
Recorded: 2017-03-22
Pages: 14
Assignors
LIN, KO-WEI
Executed: 2017-03-21
LIN, HUNG-MIAO
Executed: 2017-03-21
LIN, CHUN-LING
Executed: 2017-03-21
CHEN, YING-LIEN
Executed: 2017-03-21
TSAI, HUEI-RU
Executed: 2017-03-21
SU, SHENG-YI
Executed: 2017-03-21
Assignee
UNITED MICROELECTRONICS CORP.
NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU CITY, TAIWAN
Covered Property
(1)
Interconnect Structure and Fabrication Method Thereof