Patent Assignment
Reel/Frame 041749/0031
Assignment of Assignor's Interest
Recorded: 2017-03-27
Pages: 5
Assignors
KO, TAE HO
Executed: 2017-03-23
LEE, DAE HEE
Executed: 2017-03-23
KIM, BONG SOO
Executed: 2017-03-23
HONG, MYEONG HO
Executed: 2017-03-23
JEONG, DA YOUNG
Executed: 2017-03-23
OH, JOON SEOK
Executed: 2017-03-23
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Fan-Out Semiconductor Package
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the the Spelling of the Name of the Fifth Inventor Previously Recorded at Reel: 041749 Frame: 0031. Assignor(S) Hereby Confirms the Assignment.
Apr 4, 2017
From: KO, TAE HO; LEE, DAE HEE; KIM, BONG SOO; HONG, MYEONG HO
To: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Reel/Frame 042157/0498 →
Assignment of Assignor's Interest
Jun 3, 2019
From: SAMSUNG ELECTRO-MECHANICS CO., LTD.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 049350/0756 →